National Repository of Grey Literature 4 records found  Search took 0.01 seconds. 
Wetting Balance Method - Evaluation of PCB Material and Process Factors
Chloupek, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
Wetting Balance Method - Evaluation of PCB Material and Process Factors
Chloupek, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.

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